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| ? 2010-2013 microchip technology inc. ds70632c-page 1 mrf24wb0ma/mrf24wb0mb features ieee 802.11-compliant rf transceiver serialized unique mac address data rate: 1 and 2 mbps compatible with ieee 802.11b/g/n networks small size: 21 mm x 31 mm 36-pin surface mount module integrated pcb antenna (mrf24wb0ma) external antenna option (mrf24wb0mb) with ultra miniature coaxial (ufl) connector range: up to 400m (1300 ft.) easy integration into final product C accelerates product development, provides quicker time to market radio regulation certific ation for united states (fcc), canada (ic), europe (etsi) and japan (arib) wi-fi ? certified (wfa id: wfa7150) designed for use with microchip microcontroller families (pic18, pic24, ds pic33, and pic32) with downloadable microchip tcp/ip stack operational single operating voltage: 2.7vC3.6v (3.3v typical) temperature range: -40 c to +85 c simple, four-wire spi interface with interrupt low-current consumption: - rx mode C 85 ma (typical) - tx mode C 154 ma (+10 dbm typical) - sleep C 250 a (typical) - hibernate C <0.1 a (typical) rf/analog features ism band 2.400C2.484 ghz operation 14 channels selectable individually or domain- restricted dsss modulation data rate C 1000 kbps -91 dbm typical sensitivity at 1 mbps +10 dbm typical output power with control integrated low phase noise vco, rf frequency synthesizer, pll loop filter and pa digital vco and filter calibration integrated rssi adc and i/q dacs, rssi readings available to host balanced receiver and transmitter characteristics for low power consumption mac/baseband features hardware csma/ca acce ss control, automatic ack, and fcs creation and checking automatic mac packet retransmit hardware security engine for aes and rc4-based ciphers supports 802.1x, 802.1i security: wep, wpa-psk, and wpa-2-psk. supports infrastructure, ad hoc applications utility and smart energy - thermostats - smart meters -hvac consumer electronics - remote control - internet radio industrial controls - chemical sensors -hvac - security systems - m2m communication remote device management - location and asset tracking - automotive retail - pos terminals - wireless price tags - digital remote medical, fitness, and health care - patient asset tracking note: for products that are intended for use with any access point, it is recommended to use mrf24wg0ma/mb. mrf24wb0ma/mrf24wb0mb data sheet 2.4 ghz ieee 802.11b?
mrf24wb0ma/mrf24wb0mb ds70632c-page 2 ? 2010-2013 microchip technology inc. pin diagram note: antenna connector on mrf24wb0mb only. ? 2010-2013 microchip technology inc. ds70632c-page 3 mrf24wb0ma/mrf24wb0mb table of contents 1.0 devices over view......................................................................................................................................................................... 5 2.0 circuit description ...................................................................................................................................................................... 11 3.0 regulatory approval................................................................................................................................................................... 21 4.0 electrical characteristics ............................................................................................................................................................ 27 appendix a: revision history............................................................................................................................................................... 31 the microchip web site ......................................................................................................... .............................................................. 33 customer change notification service ................................................................................................................................................ 33 customer support ................................................................................................................................................................................ 33 reader response ................................................................................................................ ................................................................ 34 product identification system .................................................................................................. ............................................................ 35 to our valued customers it is our intention to provide our valued customers with the best documentation possible to ensure successful use of your micro chip products. to this end, we will continue to improve our publicat ions to better suit your needs. our publications will be refined and enhanced as new volumes and updates are introduced. if you have any questions or comments regard ing this publication, please contact the marketing communications department via e-mail at docerrors@microchip.com or fax the reader response form in the back of this data sheet to (480) 792-4150. we welcome your feedback. most current data sheet to obtain the most up-to-date version of this data s heet, please register at our worldwide web site at: http://www.microchip.com you can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page . the last character of the literature number is the vers ion number, (e.g., ds30000a is version a of document ds30000). errata an errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for curren t devices. as device/documen tation issues become known to us, we will publish an errata sheet. the errata will specify the revisi on of silicon and revision of document to which it applies. to determine if an errata sheet exists for a partic ular device, please check with one of the following: microchips worldwide web site; http://www.microchip.com your local microchip sales office (see last page) when contacting a sales office, please spec ify which device, revision of silicon and dat a sheet (include literature number) you are using. customer notification system register on our web site at www.microchip.com to receive the most current information on all of our products. mrf24wb0ma/mrf24wb0mb ds70632c-page 4 ? 2010-2013 microchip technology inc. notes: ? 2010-2013 microchip technology inc. ds70632c-page 5 mrf24wb0ma/mrf24wb0mb 1.0 devices overview the mrf24wb0ma and mrf24wb0mb are low-power, 2.4 ghz, ieee 802.11-compliant, surface mount modules with all associated rf components such as crystal oscillator, bypass and bias passives with integrated mac, baseband, rf and power amplifier, and built-in hardware support for aes, and tkip (wep, wpa, wpa2 security). the integrated module design frees the designer from rf and antenna design tasks and regulatory compliance testing, ultimately providing quicker time to market. the mrf24wb0ma module is approved for use with the integrated pcb meander antenna. the mrf24wb0mb has an ultra miniature coaxial connector (u.fl) and is approved for use with a list of pre-certified antennas. see section 2.8, external antenna , for specific recommendations. the mrf24wb0ma/mrf24wb0mb modules are designed to be used with microchips tcp/ip software stack. the software stack has an integrated driver that implements the api that is used in the modules for command and control, and for management and data packet traffic. the microchip tcp/ip software stack is available in the microchip application libraries for free download (including example applications and source code) from the microchip web site, http://www.microchip.com/ wireless . the combination of the module and a pic running the tcp/ip stack results in support for ieee 802.11 and ip services. this allows the immediate implementation of a wireless web server. the mrf24wb0ma/mrf24wb0mb modules have received regulatory approvals for modular devices in the united states (fcc), canada (ic), and europe (etsi). the modular approval removes the need for expensive rf and antenna de sign, and allows the end user to place the modules inside a finished product and not require regulatory testing for an intentional radiator (rf transmitter). they also have radio type approval certification for japan. see section 3.0, regulatory approval , for the specific requirements that should be adhered to by the integrator. 1.1 interface description figure 1-1 represents a mrf24wb0ma/ mrf24wb0mb module. it interfaces to microchip pic18, pic24, dspic33, or pic32 microcontrollers through a four-wire serial slave spi interface, such as interrupt, hibernate, reset, power and ground signals. the module runs on a single supply voltage of nominally 3.3v. it also supports optional jtag and serial debug for testability. the debug port operates at 3.3v and requires a level shifter for operation with rs- 232 devices. figure 1-2 shows a simplified connection between a microchips pic mcu and the module. table 1-1 lists the pin descriptions. data communications with the mrf24wb0ma/ mrf24wb0mb are through the spi interface, for more information see section 2.0, circuit descrip- tion . microchips pic mcus communicates with the module through a command api within the microchip tcp/ip stack. the command api is detailed in the microchip tcp/ip stack online help that is available in the microchip application libraries for free download. mrf24wb0ma/mrf24wb0mb ds70632c-page 6 ? 2010-2013 microchip technology inc. figure 1-1: mrf24wb0ma/m rf24wb0mb block diagram figure 1-2: microcontro ller to mrf24wb0ma/mrf24wb0mb interface spi digital i/o power encryption interface power amplifier ram rom flash jtag interrupt debug reset hibernate matching circuitry pcb antenna ) (mrf24wb0ma 2. 4 ghz ieee std. 802.11b rf transceiver module mrf24wb0ma transceiver 2.4 ghz , accelerator aes tkip pic microcontroller mrf24wb0mx gnd vdd external antenna (mrf24wb0mb) i/o cs sdo sdi sck sdi sdo sck intx int i/o hibernate i/o wp i/o reset +3.3v (typ) gnd ? 2010-2013 microchip technology inc. ds70632c-page 7 mrf24wb0ma/mrf24wb0mb table 1-1: pin description pin symbol type description 1g n d pg r o u n d 2 nc nc do not connect 3j t a g tdo o jtag test data output 4j t a g tck i: constant (1) jtag clock input (drive or pull-up only) 5j t a g tms i jtag mode input 6j t a g tdi i jtag test data input 7 reset i: constant (1) module reset input 8 nc nc do not connect 9j t a g rst i jtag reset input (optional; see section 2.0, circuit description ) 10 gnd p ground 11 nc nc do not connect 12 nc nc do not connect 13 nc nc do not connect 14 nc nc do not connect 15 nc nc do not connect 16 wp (2) i write protect (this pin is used to enable flash update) 17 v dd p power 18 gnd p ground 19 gnd p ground 20 hibernate i hibernate mode enable (high input will disable the module) 21 jtag en i jtag test enable 22 nc nc do not connect 23 cs i: constant (1) spi chip select input, consta nt drive or pull-up required 24 nc nc do not connect 25 gnd p ground 26 debug rx i serial debug port input (see section 2.0, circuit description ) 27 debug tx o serial debug port output (see section 2.0, circuit description ) 28 gnd p ground 29 v dd p power 30 gnd p ground 31 nc nc do not connect 32 sdo o spi data out 33 int o interrupt output (open drain C requires a pull-up) 34 sck i spi clock input 35 sdi i spi data in 36 gnd p ground legend: pin type abbreviation: p = power input, i = input, o = output, nc = do not connect note 1: signals of type i: constant must either be constantly driven by the host or have a pull-up or pull-down (in case the host is likely to tri-st ate the signal during power down modes). the constant drive is used to ensure defined operation of the part and to mi nimize leakage current during low power modes. 2: wp is used as write-protect for the internal module spi flash. for production use, this pin should be pulled low. this pin can be controlled by the host microcontroller to enable in field flash updates. mrf24wb0ma/mrf24wb0mb ds70632c-page 8 ? 2010-2013 microchip technology inc. 1.2 mounting details the mrf24wb0ma/mrf24wb0mb is a surface mountable module. module dimensions are shown in figure 1-3 . the module printed circuit board (pcb) is 1 mm thick with castellated mounting points on two sides. figure 1-3: mrf24wb0ma/mrf24wb0mb module physical dimensions note: antenna connector on mrf24wb0mb only. ? 2010-2013 microchip technology inc. ds70632c-page 9 mrf24wb0ma/mrf24wb0mb the mrf24wb0ma has an integrated pcb antenna. for best performance, mo unt the module on the pcb without metal obstructions in the keep out area. the antenna is tuned to have fr4 pcb material underneath the module. do not cut-out host pcb material under the antenna. figure 1-4 shows the recommended host pcb footprint for the module. figure 1-4: recommended host pcb footprint note 1: the note 1 demarcation specifies the host pcb copper plane keep-out area on underlying board layers. users can route surface escape tr aces in this area. the module has exposed copper test points on bottom side in the keep out zone. ensure that there is no exposed cop- per on mounting board that may short these. mrf24wb0ma/mrf24wb0mb ds70632c-page 10 ? 2010-2013 microchip technology inc. figure 1-5 illustrates the module reflow profile that is recommended for mounting the device onto the host pcb. figure 1-5: recommended module reflow profile and setpoints the following table lists the module re-flow profile details. 300 250 200 150 100 50 0 temperature (c) time (seconds) 05 01 0 0 1 2 150 200 250 300 3 4 5 6 7 8 zones table 1-2: module re-flow profile (1) z o n e 12345678 temperature (c) 180 180 200 200 200 220 265 270 note 1: conveyor speed: 90 cm/min. ? 2010-2013 microchip technology inc. ds70632c-page 11 mrf24wb0ma/mrf24wb0mb 2.0 circuit description the mrf24wb0ma/mrf24wb0mb interfaces to microchips pic18, pic24, dspic33, and pic32 microprocessors with a minimal of external components through digital-only connections. this section details use of t he module, starting with an example host connection as shown in figure 2-1 . 2.1 schematic figure 2-1: mrf24wb0ma/mrf24wb0mb example application schematic 2.2 power-on sequence the internal regulators for the digital and analog core power supplies are disabled by driving the hibernate pin high. figure 2-2 shows the power up sequence for the mrf24wb0ma/mrf24wb0mb. an internal power-on reset (por) circuit which keeps the module in reset until v dd is within the specification. the hibernate and reset signals are also used to control startup. in figure 2-2 , section a is controlled by the internal por and section b is an allowance for the spi bus to stabilize when the module supplies are enabled. after hibernate is disabled, the host software provides 1ms of startup to allow the spi to stabilize. this time is pre-programmed into the host driver, and may need to be increased if insufficient initial drive current is not provided to the mrf24wb0m module. section c is the dr iver controlled release from reset period. this takes approximately 300 ms and is monitored by the stack driver. no additional time needs to be provided by user software for startup. mrf24wb0ma/mrf24wb0mb ds70632c-page 12 ? 2010-2013 microchip technology inc. figure 2-2: mrf24wb0ma/mrf24wb 0mb power-on sequence timing ? 2010-2013 microchip technology inc. ds70632c-page 13 mrf24wb0ma/mrf24wb0mb 2.3 power states the mrf24wb0ma/mrf24wb0mb has the following power states: hibernate, sleep and active (two sub- states), as shown in figure 2.4 . the selection of power state affects system behavior, and overall power con- sumption or battery life. addition to that there is one standby state that is not user-controlled. figure 2-3: mrf24wb0ma/mrf24wb0mb power-state diagram 2.3.1 hibernate state an off state is defined as no power applied to the device. the hibernate mode is the closest to controlled off that the module can ap proach. it is controlled through the hibernate pin (high input puts the module into hibernate). when in hibernate, the module only consumes leakage current, but does not maintain state. hibernate has to be fully controlled by the pic mcu and requires the tcp/ip stack to restart on an awake. the module contains about 70f of internal bulk capacitance. supplies should be provisioned to supply sufficient charge on release of hibernate for required start time or sufficient delay must be provided in software after hibernate release and before reset release. this state provides the be st battery life for embedded products. entering hibernate for intervals of less than 30 seconds is not likely to save power. battery life expectation can be more than a year for devices operating on aa cells that is in hibernate except to wake up every hour for a small data transfer (<500 bytes). 2.3.2 sleep state the sleep state is a low power dynamic state that implements the 802.11 power save feature. in this mode, if enabled, the module will enter power save mode when all activity is complete. the module will wake autonomously to any pic intervention to check dtim beacons from the access point (ap). if any traffic is listed as queued for the module, then it will awaken and get the data from the ap on the next possible opportunity. when data is acquired, the module wi ll interrupt the pic microcontroller on a normal data available indication. if no data is available on a dtim check, the module reenters the power save state until the next dtim. the dtim interval is programmed at the ap. this state can provide as if on behavior of the radio with a significant power savings versus always on. the battery life expectation of this mode is several days to several weeks. this mode is char acterized by a very-low latency (as low as 200 ms) to begin data transfer from the low-power state. 2.3.3 active state the active state is identifi ed as one of the two states where the radio circuitry is fully on. the two active states are the receive state (rx on) and transmit state (tx on). note 1: see section 2.2, power-on sequence . off hibernate standby rx on tx on sleep 200 s 200 s 10 s note 1 note 1 mrf24wb0ma/mrf24wb0mb ds70632c-page 14 ? 2010-2013 microchip technology inc. 2.3.4 standby state the standby state is not use r-controlled, but it is noted as it helps identify and track certain operations of the module during power tracing. table 2-1: mrf24wb0ma/mrf24wb 0mb power state definitions state v dd hibernate description off 0v 0v power is disconnected hibernate 3.3v 3.3v all internal power regula tors are off C enabled by hibernate pin sleep 3.3v 0v enabled by tcp/ip driver rx on 3.3v 0v receive circuits are on and receiving tx on 3.3v 0v transmit circuits are on and transmitting standby 3.3v 0v state machine transition state only C not user controlled ? 2010-2013 microchip technology inc. ds70632c-page 15 mrf24wb0ma/mrf24wb0mb 2.4 jtag interface joint test action group (jtag) is the common name used for ieee 1149.1 enti tled standard test access port and boundary-scan architecture for test access ports that are used for te sting printed circuit boards using boundary scan. the mrf24wb0ma/ mrf24wb0mb supports jtag boundary scan. the jtag port provides the optional hardware jtag reset input, jtag rst . jtag_en and jtag rst need to be driven high to enable jtag mode. jtag should not be enabled during normal functional operation which affects power state current. 2.5 debug serial interface the mrf24wb0ma/mrf24wb0mb incorporates a transmit data pin (debug tx ) and a receive data pin (debug rx ) for serial debugging purposes. these pins can be connected to commercially available rs-232 line drivers/receivers wit h appropriate external level shifters. the serial interface operates at 19200, 8, n, 1, n. 2.6 spi interface the slave serial peripheral interface (spi) is used to interface with the host pic microcontroller. the slave spi interface works with the interrupt line (int ). when data is available for the pic microcontroller during operation, the int line is asserted (logic low) by the mrf24wb0ma/mrf24wb0mb module. the int line is de-asserted (logic high) by the mrf24wb0ma/ mrf24wb0mb after the data is transferred to the host pic microcontroller. the spi sck frequency can be up to 25 mhz. the slave spi interface implements the [cpol = 0 ; cpha = 0 ] and [cpol = 1 ; cpha = 1 ] modes (0 and 3) of operation. that is, data is clocked in on the first rising edge of the clock after chip select (cs ) is asserted. data is placed on the bus with most significant bit (msb) first. the cs pin must be toggled with transfer blocks and cannot be held low permanently. the falling edge of cs is used to indicate the start of a transfer. the rising edge of cs is used to indicate the completion of a transfer. figure 4-1 in section 4.0, electrical characteristics shows the spi timing diagram. ta b l e 4 - 7 details the spi timing ac characteristics. 2.7 pcb antenna for mrf24wb0ma, the pcb antenna is fabricated on the top copper layer and co vered in solder mask. the layers below the antenna have no copper trace. it is recommended that the module be mounted on the edge of the host pcb. it is permitted for pcb material to be below the antenna structure of the module as long as no copper traces or pl anes are on the host pcb in that area. for best performance, place the module on the host pcb according to the details shown in figure 1-4 . figure 2-4 , figure 2-5 and figure 2-6 show the antenna and simulated radiation patterns expected from the pcb antenna. refer to three separate axis of measurement that corresponds to the orientation of the module (drawn in the center of each plot). the horizontal and vertical data, blue and red, in each plot correspond to the orient ation (polarization) of the measurement antenna rotated 360 degrees around the module. the horizontal measurement was done with the receive antenna parallel to the module pcb. the vertical mea- surement was done perpendicular to the module pcb. these patterns allow the designer to understand the performance of the module wi th respect to the position of the receive or transmit antenna at the other end of the link. mrf24wb0ma/mrf24wb0mb ds70632c-page 16 ? 2010-2013 microchip technology inc. figure 2-4: azimuth radiat ion pattern, 2.44 ghz 0 90 180 270 0 db -5 db -10 db -15 db -20 db horizontal vertical ? 2010-2013 microchip technology inc. ds70632c-page 17 mrf24wb0ma/mrf24wb0mb figure 2-5: radiation pattern on side with pcb antenna, 2.44 ghz 0 90 180 270 horizontal vertical 0 db -5 db -10 db -15 db -20 db mrf24wb0ma/mrf24wb0mb ds70632c-page 18 ? 2010-2013 microchip technology inc. figure 2-6: radiation pattern along pin edge, 2.44 ghz 0 90 180 270 horizontal vertical 0 db -5 db -10 db -15 db -20 db ? 2010-2013 microchip technology inc. ds70632c-page 19 mrf24wb0ma/mrf24wb0mb 2.8 external antenna the choice of an external antenna is limited to the antenna types the module is tested with. refer to section 3.0, regulatory approval for specific country- wise regulatory requirements. a list of antennas types tested with the mrf24wb0mb modules is provided in table 2-2 . table 2-2: tested external antenna types part number type gain (dbi) vswr max. connector vendor rfa-02-p05 pcb 2 2.0 ipex aristotle rfa-02-l6h1-70-35 dipole 2 2.0 ipex aristotle rfa-02-d3 dipole 1.5 2.0 ipex aristotle rfa-02-l2h1 dipole 2 2.0 ipex aristotle rfa-02-3-c5h1 dipole 3 2.0 ipex aristotle rfa-02-5-c7h1 dipole 5 2.0 ipex aristotle rfa-02-5-f7h1 dipole 5 2.0 ipex aristotle wf2400-15001a dipole 5 2.0 ipex saytec wf2400-15001ar dipole 5 2.0 rf-ipex saytec wf2400-10001i dipole 2 2.0 ipex saytec wf2400-10001r dipole 2 2.0 rf-ipex saytec an2400-5901rs, used with connector smasfr8-3152h-00x00i omni 9 2.0 ipex saytec an2400-5901rs, used with connector smasfr8-3152h-00x00ir omni 9 2.0 rf-ipex saytec mrf24wb0ma/mrf24wb0mb ds70632c-page 20 ? 2010-2013 microchip technology inc. notes: ? 2010-2013 microchip technology inc. ds70632c-page 21 mrf24wb0ma/mrf24wb0mb 3.0 regulatory approval this section outlines the regulatory information for the mrf24wb0ma/mrf24wb0mb module for the following countries: united states canada europe australia new zealand korea other 3.1 united states the mrf24wb0ma/mrf24wb0mb module has received federal communications commission (fcc) cfr47 telecommunications, part 15 subpart c inten- tional radiators modular approval in accordance with part 15.212 modular transmitter approval. modular approval allows the end user to integrate the mrf24wb0ma/mrf24wb0mb module into a finished product without obtaining subsequent and separate fcc approvals for intentional radiation, provided no changes or modifications are made to the module cir- cuitry. changes or modifica tions could void the user's authority to operate the equipment. the end user must comply with all of the instructions provided by the grantee, which indicate installation and/or operating conditions necessary for compliance. the finished product is required to comply with all appli- cable fcc equipment authorizations regulations, requirements and equipment functions not associated with the transmitter module portion. for example, com- pliance must be demonstrated to regulations for other transmitter components within the host product; to requirements for unintentional radiators (part 15 subpart b unintentional radiators), such as digital devices, computer peripherals, radio receivers, etc; and to addi- tional authorization requirements for the non-transmitter functions on the transmitter module (i.e., verification, or declaration of conformity) (e.g., transmitter modules may also contain digital logic functions) as appropriate. 3.1.1 labeling and user information requirements the mrf24wb0ma/mrf24wb0mb module is labeled with its own fcc id number. if the fcc id is not visible when the module is installed inside another device, then the outside of the finished product into which the module is installed must display a label referring to the enclosed module. this exterior label can use wording as follows: a users manual for the product should include the following statement: additional information on labeling and user information requirements for part 15 devices can be found in kdb publication 784748 available at the fcc office of engi- neering and technology (oet) laboratory division knowledge database (kdb), http://apps.fcc.gov/oetcf/kdb/index.cfm . contains transmitter module fcc id: w7ozg2100-zg2101 or contains fcc id: w7ozg2100-zg2101 this device complies with part 15 of the fcc rules. operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. this equipment has been tested and found to comply with the limits for a class b digital device, pursuant to part 15 of the fcc rules. these limits are designed to provide reasonable protection against harmful interference in a residential installation. this equipment generates, uses and can radiate radio frequency energy, and if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. however, there is no guarantee that interference will not occur in a particular installation. if this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: reorient or relocate the receiving antenna. increase the separation between the equipment and receiver. connect the equipment into an outlet on a circuit different from that to which the receiver is connected. consult the dealer or an experienced radio/tv technician for help. mrf24wb0ma/mrf24wb0mb ds70632c-page 22 ? 2010-2013 microchip technology inc. 3.1.2 rf exposure all transmitters regulated by fcc must comply with rf exposure requirements. oet bulletin 65, evaluating compliance with fcc guidelines for human exposure to radio frequency electromagnetic fields , provides assistance in determining whether proposed or existing transmitting facilities, operations or devices comply with limits for human exposure to radio frequency (rf) fields adopted by the federal communications commission (fcc). the bulletin offers guidelines and suggestions for evaluating compliance. if appropriate, compliance wi th exposure guidelines for mobile and unlicensed devices can be accomplished by the use of warning labe ls and by providing users with information concer ning minimum separation distances from transmitting structures and proper installation of antennas. the following statement must be included as a caution statement in manuals and oem products to alert users of fcc rf exposure compliance: if the mrf24wb0ma/mrf24wb0mb module is used in a portable application (i.e., the antenna is less than 20 cm from persons during operation), the integrator is responsible for performing specific absorption rate (sar) testing in accordance with fcc rules 2.1091. 3.1.3 approved external antenna types to maintain modular approval in the united states, only tested antenna types must be used. it is permissible to use different manufacturer antenna provided the same antenna type and antenna gain (equal to or less than) is used. mrf24wb0mb module testing was performed with the antenna types listed in ta b l e 2 - 2 in section 2.8, exter- nal antenna . 3.1.4 helpful web sites federal communications commission (fcc): http://www.fcc.gov. fcc office of engineering and technology (oet) laboratory division knowledge database (kdb): http://apps.fcc.gov/ oetcf/kdb/index.cfm. 3.2 canada the mrf24wb0ma/mrf24wb0mb module is certi- fied for use in canada under industry canada (ic) radio standards specification (rss) rss-210 and rssgen. modular approval permits the installation of a module in a host device without the need to recertify the device. 3.2.1 labeling and user information requirements labeling requirements for the host device (from sec- tion 3.2.1, rss-gen, iss ue 3, december 2010): the host device must be labeled to identify the module within the host device. the industry canada certification label of a module must be clearly visible at all times when installed in the host device, otherwise the host device must be labeled to display the industry ca nada certification number of the module, preceded by the words contains transmit- ter module, or the word c ontains, or similar wording expressing the same meaning, as follows: user manual notice for license-exempt radio appara- tus (from section 7.1.3, rss-gen, issue 3, december 2010): user manuals for lice nse-exempt radio apparatus must contain the following or equivalent notice in a con- spicuous location in the user manual or alternatively on the device or both: to satisfy fcc rf exposure requirements for mobile and base station transmission devices, a separation distance of 20 cm or more should be maintained between the antenna of this device and persons during operation. to ensure compliance, operation at closer than this distance is not recommended. the antenna(s) used for this transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. contains transmitter module ic: 8248a-g21zerog this device complies with industry canada license-exempt rss st andard(s). operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. le prsent appareil est conforme aux cnr d'industrie canada applicables aux appareils radio exempts de licence. l'exploitation est autorise aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radiolec- trique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. ? 2010-2013 microchip technology inc. ds70632c-page 23 mrf24wb0ma/mrf24wb0mb transmitter antenna (from section 7.1.2, rss-gen, issue 3, december 2010): user manuals for transmit- ters must display the following notice in a conspicuous location: the above notice may be affixed to the device instead of displayed in the user manual. user manuals for transmitters equipped with detachable antennas shall also contain the following notice in a conspicuous location: after the preceding notice, the manufacturer must pro- vide a list of all antenna types approved for use with the transmitter, indicating the maximum permissible antenna gain (in dbi) and required impedance for each. 3.2.2 approved external antenna types transmitter antenna (from section 7.1.2 rss-gen, issue 3, december 2010): the mrf24wb0ma/mrf24wb0mb module can only be sold or operated with antennas with which it was approved. transmitter may be approved with multiple antenna types. an antenna type comprises antennas having similar in-band and out-of-band radiation pat- terns. testing shall be performed using the highest gain antenna of each combination of transmitter and antenna type for which approval is being sought, with the transmitter output power set at the maximum level. any antenna of the same type having equal or lesser gain as an antenna that had been successfully tested with the transmitter, will also be considered approved with the transmitter, and may be used and marketed with the transmitter. when a measurement at the antenna connector is used to determine rf output power, the effective gain of the devices antenna sh all be stated, based on measurement or on data from the antenna manufacturer. for transmitt ers of output power greater than 10 milliwatts, the total antenna gain shall be added to the measured rf output power to demonstrate compliance to the specified radiated power limits. approved external antenna types for the mrf24wb0mb module are listed in ta b l e 2 - 2 in section 2.8, external antenna . 3.2.3 helpful web sites industry canada: http://www.ic.gc.ca/. 3.3 europe the mrf24wb0ma/mrf24wb0mb module is an r&tte directive assessed radio module that is ce marked, and manufactured and tested with the inten- tion of being integrated into a final product. the mrf24wb0ma/mrf24wb0mb module tested to r&tte directive 1999/5/ec essential requirements for health and safety (article (3.1(a)), electromagnetic com- patibility (emc) (article 3.1( b)), and radio (article 3.2) and are summarized in table 3-1 . a notified body opin- ion has also been issued. all test reports are available on the mrf24wb0ma/mrf24wb0mb product web page at http://www.microchip.com . the r&tte compliance association provides guid- ance on modular devices in the document technical guidance note 01 , which is available at http:// www.rtteca.com/html /download_area.htm . under industry canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by industry canada. to reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. conformment la rglementation d'industrie canada, le prsent metteur radio peut fonction- ner avec une antenne d'un type et d'un gain maxi- mal (ou infrieur) approuv pour l'metteur par industrie canada. dans le but de rduire les ris- ques de brouillage radiolectrique l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope ray- onne quivalente (p.i.r.e.) ne dpasse pas l'inten- sit ncessaire l'tablissement d'une communication satisfaisante. this radio transmitter (identify the device by certifi- cation number, or model number if category ii) has been approved by industry canada to operate with the antenna types listed below with the maximum permissible gain and required antenna impedance for each antenna type indicated. antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. conformment la rglementation d'industrie canada, le prsent metteur radio peut fonction- ner avec une antenne d'un type et d'un gain maxi- mal (ou infrieur) approuv pour l'metteur par industrie canada. dans le but de rduire les ris- ques de brouillage radiolectrique l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope ray- onne quivalente (p.i.r.e.) ne dpasse pas l'inten- sit ncessaire l'tablissement d'une communication satisfaisante. mrf24wb0ma/mrf24wb0mb ds70632c-page 24 ? 2010-2013 microchip technology inc. 3.3.1 labeling and user information requirements the label on the final product which contains the mrf24wb0ma/mrf24wb0mb module must follow ce marking requirements. the r&tte compliance associ- ation document technical guidance note 01 provides guidance on final product ce marking. 3.3.2 external antenna requirements from the r&tte compliance association document technical guidance note 01: provided the integrator installing an assessed radio module with an integral or specific antenna and installed in conformance with the radio module manu- facturer's installation instructions requires no further evaluation under article 3.2 of the r&tte directive and does not require further involvement of an r&tte directive notified body for the final product. see section 2.3.4, standby state . the european compliance testing listed in table 3-1 was performed using the antenna types listed in section 2.8, external antenna . 3.3.3 helpful web sites a document that can be used as a starting point in understanding the use of short range devices (srd) in europe is the european radio communications com- mittee (erc) recommendation 70-03 e, which can be downloaded from the european radio communications office (ero) at: http://www.ero.dk/ . additional helpful web sites are: radio and telecommunications terminal equipment (r&tte): http://ec.europa.eu/enter prise/rtte/index_en.htm. european conference of postal and telecommu- nications administrations (cept): http://www.cept.org european telecommunications standards institute (etsi): http://www.etsi.org european radio communications office (ero): http://www.ero.dk 3.4 australia the australia radio regulations do not provide a modu- lar approval policy similar to the united states (fcc) and canada (ic). however, mrf24wb0ma/ mrf24wb0mb module rf transmitter test reports can be used in part to demonstrate compliance in accor- dance with acma radio communications short range devices standard 2004 (the short range devices standard calls up the as/nzs 4268:2008 industry standard). the mrf24wb0ma/ mrf24wb0mb module test reports can be used as part of the product certific ation and compliance folder. for more information on the rf transmitter test reports, contact microchip technology australia sales office. to meet overall australian final product compliance, the developer must construct a compliance folder containing all relevant compliance test reports, for example rf, emc, electrical safety and declaration of conformity (doc) and so on. integrator must know what is required in the compliance folder for acma compliance. all test reports are available on the mrf24wb0ma/mrf24wb0mb product web page at http://www.microchip.com . for more information on australia compliance, re fer to the australian communications and media authority web site http:// www.acma.gov.au/ . 3.4.1 external antenna requirements the compliance testing listed in table 3-1 was per- formed using the antenna types listed in table 2-2 in section 2.8, external antenna . 3.4.2 helpful web sites the australian communications and media authority: http://www.acma.gov.au/ . note: to maintain conformance to the testing listed in table 3-1 : european compliance testing, the module shall be installed in accordance with the installation instructions in this data sheet and shall not be modified. when integrating a radio module into a completed product the integrator becomes the manufacturer of the final product and is therefore responsible for demonstrating compliance of the final product with the essential requirements of the r&tte directive. table 3-1: european compliance testing certification standards article laboratory report number date safety iec 60950-1:2001 (3.1(a)) tuv rheinland 30883573.001 2009-03-11 emc en 301 489-1 v1.8.1 (2008-04) (3.1(b)) 30853571.004 2009-03-16 en 301 489-17 v1.2.1 (2002-04) radio en 300 328 v1.7.1 (2006-10) (3.2) 30853571.003 2009-04-28 ? 2010-2013 microchip technology inc. ds70632c-page 25 mrf24wb0ma/mrf24wb0mb 3.5 new zealand the new zealand radio regulations do not provide a modular approval policy similar to the united states (fcc) and canada (ic). however, mrf24wb0ma/ mrf24wb0mb module rf transmitter test reports can be used in part to demonstrate compliance against the new zealand general user radio license for short range devices. new zealand radio communications (radio standards) notice 2010 calls up the as/nzs 4268:2008 industry standard. the mrf24wb0ma/ mrf24wb0mb module test reports can be used as part of the product certific ation and compliance folder. all test reports are available on the mrf24wb0ma/ mrf24wb0mb product web page at http://www.micro- chip.com . for more information on the rf transmitter test reports, contact microc hip technology sales office. information on the new zealand short range devices license can be found in the following web sites: http://www.rsm.govt.nz/cms/licensees/types-oflicence/ general-user-licences/short-range-devices . and http://www.rsm.govt.nz/cms /policy-and-planning/spec- trum-policy-overview/legislation/gazette-notices/prod- uct-compliance/radiocommuni cations-radiostandards- notice-2010 . to meet overall new zealand final product compliance, the developer must construct a compliance folder with all relevant compliance test reports, for example rf, emc, electrical safety and doc (declaration of confor- mity) etc. the developer must know what is required in the compliance folder for new zealand radio commu- nications. for more informa tion on new zealand com- pliance, refer to the web site http://www.rsm.govt.nz/ . 3.5.1 external antenna requirements the compliance testing listed in ta b l e 3 - 1 was per- formed using the antenna types listed in ta b l e 2 - 2 in section 2.8, external antenna . 3.5.2 helpful web sites radio spectrum ministry of economic development: http://www.rsm.govt.nz/ . 3.6 korea the mrf24wb0ma/mrf24wb0mb module has received certification of conformity in accordance with the radio waves act. integration of this module into a final product does not require additional radio certification provided installation instructions are followed and no modifications of the module are allowed. 3.6.1 labeling and user information requirements the label on the final product which contains the mrf24wb0ma/mrf24wb0mb module must follow kc marking requirements. t he integrator of the module should refer to the labeling requirements for korea available on the korea communications commission (kcc) web site. the mrf24wb0ma/mrf24wb0mb module is labeled with its own kc mark. the final product requires the kc mark and certificate number of the module: 3.6.2 external antenna requirements the korea compliance testing was performed using the antenna types listed in ta b l e 2 - 2 in section 2.8, external antenna . 3.6.3 helpful web sites korea communications commission (kcc): http://www.kcc.go.kr . national radio research agency (rra): http://rra.go.kr. 3.7 other regulatory jurisdictions other regulatory jurisdiction certification must be required by the customer, or the customer need to recertify the module for othe r reasons, a certification utility is available. the utility runs on a windows pc and utilizes a usb to spi converter to interface to the mrf24wb0m module. to use the utility, the mrf24wb0m module must be out of reset and not accessed by the system host . that is, the spi signals to the mrf24wb0m must be tri-state, with reset and hibernate deasserted. the following signals will need to be brought from the mrf24wb0m for connection to the pc (through the usb adapter): sdo sdi cs sck int gnd for further regulatory certification utility and documentation, contact local microchip sales office. mrf24wb0ma/mrf24wb0mb ds70632c-page 26 ? 2010-2013 microchip technology inc. 3.8 wi-fi ? alliance wi-fi alliance certificatio n focuses on interoperability testing of devices based on 802.11 standards. historically, when the certification process and programs were developed by wi-fi alliance members, the vast majority of the 802.11 clients were pc-centric, and certification testing adequately addressed those types of devices. in subs equent years, the number of wi-fi devices that are not pc-centric has grown significantly. these non-standard devices, as a class of products, have been dubbed application specific devices (asds) by the wi-fi alliance. asds are 802.11 devices, for example clients or access points (aps), which cannot be tested under a standard alliance test plan because they do not comply with the standard test configuration, and because they are designed to perform a specific applicati on. for example, bar code scanners, pagers, recording devices, monitoring equipment, and cable modems. the aps or clients that are used to validate asd compliance (from the standard test bed) will meet all of the requirements specified in the applicable system interoperability test plans (referred to as the standard test plan), unless spec ifically exempted. the mrf24wb0ma and mrf24wb0mb modules are in the asd category. the modules are certified under wi-fi 802.11 with wpa2, wpa, and wep system interoperability asd model test plan with test engine for ieee 802.11a, b, and g devices (version 1.0). per the wi-fi alliance approved asd test plan, the definition of the microchip mrf24wb0ma and mrf24wb0mb modular solutions is expressed in the following statements: member wireless soluti on is a single-chip 802.11b module including mac, baseband, rf and power amplifier personal sta. it utilizes a simple to use api for embedded markets, and an os is not a requirement for operation. it supports 1 and 2 mbps (tx and rx). it also supports wep, wpa personal, and wpa2 personal security. ciphers supported are aes and tkip. the member wireless solution interfaces with the host through spi bus. some applications for the member wireless solution are as following: sensors/controls such as industrial and factory sensors, hvac, and lighting consumer electronic such as remote controls, toys, and internet radio this certification ensures that the mrf24wb0ma and mrf24wb0mb modules have passed rigorous testing for interoperability across existing consumer and business wi-fi equipments, and their certifications ar e completed (wfa id: wfa7150). the certification effort undertaken will save customers time and money. for modular policy, refer to wfa module policy (version 2.2; march 2006). ? 2010-2013 microchip technology inc. ds70632c-page 27 mrf24wb0ma/mrf24wb0mb 4.0 electrical characteristics note 1: listed absolute maximum ratings are not meant for func tional operation. operation at these levels is not guaranteed, and may reduce the operating life of the component. note 1: while 3.63v is the maximum operating voltage, the modul e will detect an overvoltage condition at 4.2v and disable the rf transmit function after 0.5 ms. this is an rf certification requirement pertaining to disabling transmission in unforeseen over-voltage conditions. table 4-1: digital electrical characte ristics (nominal conditions: 25c, v dd =3.3v) parameters min typ max units v il (input low voltage) -0.3 0.8 v v ih (input high voltage) 2 5.5 v v ol (output low voltage) 0.4 v v oh (output high voltage) 2.4 v i ol (output low level current at v ol max) 8.5 ma i oh (output high level current at v oh min) 15.4 ma table 4-2: absolute maximum ratings (1) parameters min max notes storage temperature -40c +125c v dd 0v 4.2v for 0.5 ms v dd above this level and duration will disable radio v in on sdi, cs , sck -0.3v 5.5v table 4-3: recommended operating conditions parameters min typ max units ambient temperature -40 +85 degrees celsius v dd C for fcc and ic 2.70 3.3 3.63 (1) volts mrf24wb0ma/mrf24wb0mb ds70632c-page 28 ? 2010-2013 microchip technology inc. note 1: sleep current is current consumed during periods of standby between dtim beacons. the module will awake 2 ms before a dtim and turn on its receiver, and possibly its transmitter (if data is available for it). 2: i dd core is current consumed by the part not including the i/ o consumption of the spi port. 3: current consumption values represent typical peak cu rrents, and the measured current conditions were done with 85% duty cycle modu lated signal. wi-fi ? applications typicall y operate at less than 85% tx duty cycle. tx current is dependent on such criteria as transmit powe r setting, and transmit data rate and bandwidth being used. rx current is affected by connection distance. note 1: nominal conditions: 25c, v dd = 3.3v, flo = 2437 mhz, meas urements at antenna port. note 1: nominal conditions: 25c, v dd = 3.3v, flo = 2437 mhz, 2 mbps. modulated signal measured at antenna port. table 4-4: current consumption (3) (nominal condi tions: 25c, v dd = 3.3v) parameters min typ max units i dd , hibernate = 3.3v 0.1 a i dd , sleep (software enabled) 250 (1) a i dd , standby (transitional state) 10 ma i dd core (2) , rx on, receive @-83 dbm with 2 mbps modulated signal at antenna port 8 5m a i dd core, tx on, +0 dbm 115 ma i dd core, tx on, +10 dbm 154 ma table 4-5: receiver ac characteristics (1) parameters min typ max units flo 2412 2484 mhz rx min input level sensitivity, 1 mbps, 8% per -91 dbm rx min input level sensitivity, 2 mbps, 8% per -88 dbm rx max input level (power), 1 mbps, 8% per -4 dbm rx max input level (power), 2 mbps, 8% per -4 dbm table 4-6: transmitter ac characteristics (1) parameters min typ max units flo 2412 2484 mhz average pout (transmit spec trum mask compliant) +10 dbm average pout gain step resolution from +5 to +10 dbm 0.5 db average pout gain step resolution from -5 to +5 dbm 1.0 db average pout settled variation -0.5 0.5 db ? 2010-2013 microchip technology inc. ds70632c-page 29 mrf24wb0ma/mrf24wb0mb figure 4-1: spi input timing cs must be toggled for each spi block transfer. figure 4-2: spi output timing cs sck si so t css t hd t su t csd lsb in msb in high-impedance t csh t sck cs sck so msb out lsb out t dis dont care si t v t v lsb in t sck table 4-7: spi interface ac characteristics symbol parameters min max units t sck sck period 40 ns t csd cs high time 50 ns t css cs setup time 50 ns t csh cs hold time 50 ns t su sdi setup time 10 ns t hd sdi hold time 10 ns t v sdo valid time 15 ns mrf24wb0ma/mrf24wb0mb ds70632c-page 30 ? 2010-2013 microchip technology inc. notes: ? 2010-2013 microchip technology inc. ds70632c-page 31 mrf24wb0ma/mrf24wb0mb appendix a: revision history revision a (april 2010) this is the initial releas ed version of the document. revision b (june 2011) this revision includes the following updates: updated section operational changed temperature range to -20 c to +85 c updated table 1-1 : added type and pin description to pin 23. updated table 4-3 replaced figure 2-2 updated section 2.0, circuit description added section 3.7, other regulatory jurisdictions updated the temperature on the order code in section product identification system minor changes to the text and formatting were incorporated throughout the document revision c (may 2013) updated the standard temperature specification to industrial correction on bias for jtag_tck minor changes to the text and formatting were incorporated throughout the document mrf24wb0ma/mrf24wb0mb ds70632c-page 32 ? 2010-2013 microchip technology inc. notes: ? 2010-2013 microchip technology inc. ds70632c-page 33 mrf24wb0ma/mrf24wb0mb the microchip web site microchip provides online support via our www site at www.microchip.com . this web site is used as a means to make files and information easily available to customers. accessible by using your favorite internet browser, the web site contains the following information: product support C data sheets and errata, application notes and sample programs, design resources, users guides and hardware support documents, latest software releases and archived software general technical support C frequently asked questions (faqs), technical support requests, online discussion groups, microchip consultant program member listing business of microchip C product selector and ordering guides, latest microchip press releases, listing of seminars and events, listings of microchip sales offices, distributors and factory representatives customer change notification service microchips customer notification service helps keep customers current on microchip products. subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. to register, access the microchip web site at www.microchip.com . under support, click on customer change notification and follow the registration instructions. customer support users of microchip products can receive assistance through several channels: distributor or representative local sales office field application engineer (fae) technical support development systems information line customers should contact their distributor, representative or field application engineer (fae) for support. local sales offices are also available to help customers. a listing of sa les offices and locations is included in the back of this document. technical support is available through the web site at: http://microchip.com/support mrf24wb0ma/mrf24wb0mb ds70632c-page 34 ? 2010-2013 microchip technology inc. reader response it is our intention to provide you with the best documentation possible to ensure succe ssful use of your microchip product. if you wish to provide your comments on organiz ation, clarity, subject matter, and ways in which our documentation can better serve you, please fax your comments to the technical publications manager at (480) 792-4150. please list the following information, and use this outli ne to provide us with your comments about this document. to: technical publications manager re: reader response total pages sent ________ from: name company address city / state / zip / country telephone: (_______) _________ - _________ application (optional): would you like a reply? y n device: literature number: questions: fax: (______) _________ - _________ ds70632c mrf24wb0ma/mrf24wb0mb 1. what are the best features of this document? 2. how does this document meet your hardware and software development needs? 3. do you find the organization of this document easy to follow? if not, why? 4. what additions to the document do you th ink would enhance the structure and subject? 5. what deletions from the document could be made without affecting the overall usefulness? 6. is there any incorrect or misleading information (what and where)? 7. how would you improve this document? ? 2010-2013 microchip technology inc. ds70632c-page 35 mrf24wb0ma/mrf24wb0mb product identification system to order parts, including industrial, or obtain information, for e.g., on pricing or delivery, refer to the factory or the list ed sales office . part no. -x x t tape and module temperature range device device mr24wb0ma/mrf24wb0mb; v dd range 2.7v to 3.6v temperature range -40 ? c to +85 ? c (industrial temp) examples: a) mrf24wb0ma/rm = industrial temp. tray b) mrf24wb0mb/rm = industrial temp. tray m module type reel mrf24wb0ma/mrf24wb0mb ds70632c-page 36 ? 2010-2013 microchip technology inc. notes: ? 2010-2013 microchip technology inc. ds70632c-page 37 information contained in this publication regarding device applications and the like is prov ided only for your convenience and may be superseded by updates. it is your responsibility to ensure that your application me ets with your specifications. microchip makes no representations or warranties of any kind whether express or implied, written or oral, statutory or otherwise, related to the information, including but not limited to its condition, quality, performance, merchantability or fitness for purpose . microchip disclaims all liability arising from this information and its use. use of microchip devices in life support and/or safe ty applications is entirely at the buyers risk, and the buyer agrees to defend, indemnify and hold harmless microchip from any and all damages, claims, suits, or expenses resulting fr om such use. no licenses are conveyed, implicitly or ot herwise, under any microchip intellectual property rights. trademarks the microchip name and logo, th e microchip logo, dspic, flashflex, k ee l oq , k ee l oq logo, mplab, pic, picmicro, picstart, pic 32 logo, rfpic, sst, sst logo, superflash and uni/o are registered trademarks of microchip technology incorporated in the u.s.a. and other countries. filterlab, hampshire, hi-tech c, linear active thermistor, mtp, seeval and the embedded control solutions company are registered tradema rks of microchip technology incorporated in the u.s.a. silicon storage technology is a registered trademark of microchip technology inc. in other countries. analog-for-the-digital age, a pplication maestro, bodycom, chipkit, chipkit logo, codeguard, dspicdem, dspicdem.net, dspicworks, dsspeak, ecan, economonitor, fansense, hi-tide, in-circuit serial programming, icsp, mindi, miwi, mpasm, mpf, mplab certified logo, mplib, mplink, mtouch, omniscient code generation, picc, picc-18, picdem, picdem.net, pickit, pictail, real ice, rflab, select mode, sqi, serial quad i/o, total endurance, tsharc, uniwindriver, wiperlock, zena and z-scale are trademarks of microchip technology incorporated in the u.s.a. and other countries. sqtp is a service mark of mi crochip technology incorporated in the u.s.a. gestic and ulpp are registered trademarks of microchip technology germany ii gmbh & co. & kg, a subsidiary of microchip technology inc., in other countries. all other trademarks mentioned herein are property of their respective companies. ? 2010-2013, microchip technology incorporated, printed in the u.s.a., all rights reserved. printed on recycled paper. isbn: 978-1-62077-226-3 note the following details of the code protection feature on microchip devices: microchip products meet the specification cont ained in their particular microchip data sheet. microchip believes that its family of products is one of the mo st secure families of its kind on the market today, when used i n the intended manner and under normal conditions. there are dishonest and possibly illegal meth ods used to breach the code protection fe ature. all of these methods, to our knowledge, require using the microchip products in a manner outside the operating specif ications contained in microchips data sheets. most likely, the person doing so is engaged in theft of intellectual property. microchip is willing to work with the customer who is concerned about the integrity of their code. neither microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as unbreakable. code protection is constantly evolving. we at microchip are committed to continuously improving the code protection features of our products. attempts to break microchips c ode protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your softwa re or other copyrighted work, you may have a right to sue for relief under that act. microchip received iso/ts-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona; gresham, oregon and design centers in california and india. the companys quality system processes and procedures are for its pic ? mcus and dspic ? dscs, k ee l oq ? code hopping devices, serial eeproms, microperi pherals, nonvolatile memory and analog products. in addition, microchips quality system for the design and manufacture of development systems is iso 9001:2000 certified. quality ? management ? ? s ystem ? certified ? by ? dnv ? == iso/ts ? 16949 ? == ? ds70632c-page 38 ? 2010-2013 microchip technology inc. americas corporate office 2355 west chandler blvd. chandler, az 85224-6199 tel: 480-792-7200 fax: 480-792-7277 technical support: http://www.microchip.com/ support web address: www.microchip.com atlanta duluth, ga tel: 678-957-9614 fax: 678-957-1455 boston westborough, ma tel: 774-760-0087 fax: 774-760-0088 chicago itasca, il tel: 630-285-0071 fax: 630-285-0075 cleveland independence, oh tel: 216-447-0464 fax: 216-447-0643 dallas addison, tx tel: 972-818-7423 fax: 972-818-2924 detroit farmington hills, mi tel: 248-538-2250 fax: 248-538-2260 indianapolis noblesville, in tel: 317-773-8323 fax: 317-773-5453 los angeles mission viejo, ca tel: 949-462-9523 fax: 949-462-9608 santa clara santa clara, ca tel: 408-961-6444 fax: 408-961-6445 toronto mississauga, ontario, canada tel: 905-673-0699 fax: 905-673-6509 asia/pacific asia pacific office suites 3707-14, 37th floor tower 6, the gateway harbour city, kowloon hong kong tel: 852-2401-1200 fax: 852-2401-3431 australia - sydney tel: 61-2-9868-6733 fax: 61-2-9868-6755 china - beijing tel: 86-10-8569-7000 fax: 86-10-8528-2104 china - chengdu tel: 86-28-8665-5511 fax: 86-28-8665-7889 china - chongqing tel: 86-23-8980-9588 fax: 86-23-8980-9500 china - hangzhou tel: 86-571-2819-3187 fax: 86-571-2819-3189 china - hong kong sar tel: 852-2943-5100 fax: 852-2401-3431 china - nanjing tel: 86-25-8473-2460 fax: 86-25-8473-2470 china - qingdao tel: 86-532-8502-7355 fax: 86-532-8502-7205 china - shanghai tel: 86-21-5407-5533 fax: 86-21-5407-5066 china - shenyang tel: 86-24-2334-2829 fax: 86-24-2334-2393 china - shenzhen tel: 86-755-8864-2200 fax: 86-755-8203-1760 china - wuhan tel: 86-27-5980-5300 fax: 86-27-5980-5118 china - xian tel: 86-29-8833-7252 fax: 86-29-8833-7256 china - xiamen tel: 86-592-2388138 fax: 86-592-2388130 china - zhuhai tel: 86-756-3210040 fax: 86-756-3210049 asia/pacific india - bangalore tel: 91-80-3090-4444 fax: 91-80-3090-4123 india - new delhi tel: 91-11-4160-8631 fax: 91-11-4160-8632 india - pune tel: 91-20-2566-1512 fax: 91-20-2566-1513 japan - osaka tel: 81-6-6152-7160 fax: 81-6-6152-9310 japan - tokyo tel: 81-3-6880- 3770 fax: 81-3-6880-3771 korea - daegu tel: 82-53-744-4301 fax: 82-53-744-4302 korea - seoul tel: 82-2-554-7200 fax: 82-2-558-5932 or 82-2-558-5934 malaysia - kuala lumpur tel: 60-3-6201-9857 fax: 60-3-6201-9859 malaysia - penang tel: 60-4-227-8870 fax: 60-4-227-4068 philippines - manila tel: 63-2-634-9065 fax: 63-2-634-9069 singapore tel: 65-6334-8870 fax: 65-6334-8850 taiwan - hsin chu tel: 886-3-5778-366 fax: 886-3-5770-955 taiwan - kaohsiung tel: 886-7-213-7828 fax: 886-7-330-9305 taiwan - taipei tel: 886-2-2508-8600 fax: 886-2-2508-0102 thailand - bangkok tel: 66-2-694-1351 fax: 66-2-694-1350 europe austria - wels tel: 43-7242-2244-39 fax: 43-7242-2244-393 denmark - copenhagen tel: 45-4450-2828 fax: 45-4485-2829 france - paris tel: 33-1-69-53-63-20 fax: 33-1-69-30-90-79 germany - munich tel: 49-89-627-144-0 fax: 49-89-627-144-44 italy - milan tel: 39-0331-742611 fax: 39-0331-466781 netherlands - drunen tel: 31-416-690399 fax: 31-416-690340 spain - madrid tel: 34-91-708-08-90 fax: 34-91-708-08-91 uk - wokingham tel: 44-118-921-5869 fax: 44-118-921-5820 worldwide sales and service 11/29/12 |
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